Method for removing particles from a semiconductor processing tool
US6786222B2 · kind B2 · utility
4Cited by
2References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2002 |
| Grant date | Sep 7, 2004 |
| Priority date | — |
| Expiry date | Oct 25, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for removing particles from a semiconductor processing tool is provided. The method comprises providing a pick-up wafer for picking up particles from a semiconductor processing tool, inserting said pick-up wafer into said semiconductor processing tool and placing the pick-up wafer on a receiving member, applying an electrostatic charge to said pick-up wafer, leaving said pick-up wafer in said semiconductor processing tool for a predetermined dwell time; and removing said pick-up wafer from said semiconductor processing tool. Further, a method for processing semiconductor wafers is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.