Surface mount interconnect and device including same
US6786736B2 · kind B2 · utility
8Cited by
15References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2002 |
| Grant date | Sep 7, 2004 |
| Priority date | — |
| Expiry date | Aug 23, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/368
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A surface mount interconnect is disclosed. The interconnect includes a solid conductor having a first section, a second section, and a central section between the first and second sections. The first section includes at least one curved surface, and the second section includes at least one curved surface. The central section includes first and second planar surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.