Interconnection system with improved high frequency performance
US6786771B2 · kind B2 · utility
211Cited by
9References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 20, 2002 |
| Grant date | Sep 7, 2004 |
| Priority date | — |
| Expiry date | Dec 20, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/719
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An interconnection system is described. Absorptive material is selectively positioned throughout the system to improve the high frequency performance of the system. Various embodiments are illustrated, including a backplane-daughtercard connector and a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.