Onboard multiphase electronic lapping guide design for MR heads
US6786803B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2002 |
| Grant date | Sep 7, 2004 |
| Priority date | — |
| Expiry date | Nov 19, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/39
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An onboard electronic lapping guide for lapping a magneto-resistive head having a magneto-resistive sensor element disposed for electrical communication with a pair of sensor electrical leads. The lapping guide includes an electronic lapping guide resistive element disposed for electrical communication with the sensor electrical leads. The resistive element has a predetermined height in a lapping direction and is adapted to produce an electrical resistance in the presence of a lapping current that increases as said resistive element height is reduced during lapping. A lapping method and a method of forming the onboard electronic lapping guide are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.