Resin composition for bonded magnet and bonded magnet using the same
US6787059B2 · kind B2 · utility
1Cited by
1References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2003 |
| Grant date | Sep 7, 2004 |
| Priority date | — |
| Expiry date | Mar 26, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F1/113
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A resing composition for bonded magnet of the present invention comprises:magnetic particles; andan aromatic polyamide resin comprising an aromatic carboxylic acid and an aliphatic diamine, which has a molar rational of residual end carboxyl groups to residual end amino groups of 0.1 to 1.0 and a solution viscosity of not more than 1.1 dl/g. The resin composition for bonded magnet is excellent inmoldability, and a bonded magnet using such a resing composition is excellent in mechanical strength and heat resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.