Data storage and processing apparatus, and method for fabricating the same

US6787825B1 · kind B1 · utility

Assignee

• Thin Film Electronics ASA · NO

Inventors

• Hans Gude Gudesen · Fredrikstad, NO
• Per-Erik Nordal · Asker, NO
• Geirr I. Leistad · Sandvika, NO
• Johan Carlsson · Cologne, DE
• Goran Gustafsson · Säter, SE
• Michael O. Thompson · Ithaca, US

Key dates

• Filing date: Jan 2, 2001
• Grant date: Sep 7, 2004
• Expiry date: Jan 2, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10B53/00
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A data storage/processing apparatus includes ROM and/or WORM and/or REWRITEABLE memory modules and/or processing modules provided as a single main layer or multiple main layers on top of a substrate. Transistors and/or diodes operate the apparatus. In one set of embodiments, at least some of the transistors and/or diodes are provided on or in the substrate. In another set of embodiments, at least some of the layers on the top of the substrate include low-temperature compatible organic materials and/or low temperature compatible processes inorganic films, and the transistors and/or diodes need not be disposed on or in the substrate. In a related fabricating method, the memory and/or processing modules are provided on the substrate by depositing the layers in successive steps under thermal conditions that avoid subjecting an already-deposited, processed underlying layers to static or dynamic temperatures exceeding given stability limits, particularly with regard to organic materials.