Flip-chip opto-electronic circuit
US6787919B2 · kind B2 · utility
4Cited by
9References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 27, 2001 |
| Grant date | Sep 7, 2004 |
| Priority date | — |
| Expiry date | Dec 27, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0212
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A thermo-optic switch comprises two planar waveguide and a heating element couple to at least one of the planar waveguides. The heating element is coupled to a package substrate using solder bumps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.