Mounting method of semiconductor device
US6787925B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2001 |
| Grant date | Sep 7, 2004 |
| Priority date | — |
| Expiry date | Mar 14, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/07811
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of mounting a semiconductor device having bumps on a board having pads so that each of the bumps is joined to a corresponding one of the pads is provided. Adhesive to be hardened by heat is provided between the semiconductor device and the board. The method includes the steps of pressing the bumps of the semiconductor device on the pads of the board, and heating a portion in which each of the bumps and a corresponding one of the pads are in contact with each other. A pressure of the bumps to the pads reaches a predetermined value before a temperature of the adhesive to which heat is supplied in the above step reaches a temperature at which the adhesive is hardened.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.