Damped micromechanical device
US6787969B2 · kind B2 · utility
40Cited by
6References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2001 |
| Grant date | Sep 7, 2004 |
| Priority date | — |
| Expiry date | Jun 6, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2203/0136
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A damped micromechanical device comprising a substrate, a movable structure overlying the substrate and a flexural member having a first end portion coupled to the substrate and a second end portion coupled to the movable structure. The movable structure is movable at a resonant frequency between first and second positions relative to the substrate. A damping material is adhered to at least a portion of the flexural member for damping the movement of the movable structure at the resonant frequency. A method for making the micromechanical device is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.