Production of material libraries using sputter methods
US6790322B2 · kind B2 · utility
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3References
30Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 13, 2002 |
| Grant date | Sep 14, 2004 |
| Priority date | — |
| Expiry date | Nov 13, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC40B60/14
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
In a process for the combinatorial production of a library of materials in the form of a two-dimensional matrix in the surface region of a planar substrate by sputtering, the planar target used for the sputtering is arranged in parallel to the planar substrate and has surface regions of different chemical composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.