Photoreactive resin composition and method of manufacturing circuit board and ceramic multilayer substrate using the resin composition
US6790596B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2002 |
| Grant date | Sep 14, 2004 |
| Priority date | — |
| Expiry date | Dec 27, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/117
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A photoreactive resin composition having high sensitivity and causing less gelation, and methods of manufacturing a circuit board and a ceramic multilayer substrate having a high-resolution wiring pattern and via holes by a photolithography process using the photoreactive resin composition are described. The photoreactive resin composition contains an inorganic powder containing a polyvalent metal powder and/or a polyvalent metal oxide powder, an alkali-soluble first polymer having an ethylenically unsaturated double bond, a monomer having an ethylenically unsaturated double bond, a photoreaction initiator, an organic solvent, and a second polymer having a pyrrolidone ring in a side chain.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.