Low dielectric constant polymers having good adhesion and toughness and articles made with such polymers
US6790792B2 · kind B2 · utility
5Cited by
10References
5Claims
0Family size
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Key dates
| Filing date | Apr 29, 2002 |
| Grant date | Sep 14, 2004 |
| Priority date | — |
| Expiry date | Apr 29, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0326
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cured polyphenylene polymer having a glass transition temperature no greater than 465° C. An integrated circuit article having a fracture toughness as determined by the modified edge liftoff test of at least 0.3 MPa-m1/2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.