Chip electronic component
US6791163B2 · kind B2 · utility
8Cited by
1References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2003 |
| Grant date | Sep 14, 2004 |
| Priority date | — |
| Expiry date | Sep 9, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A chip electronic component including a ceramic element and terminal electrodes with metal coating thereon formed on the surface of the ceramic element. A glass layer is formed on a part of the surface of the ceramic element where the terminal electrodes are not formed. A glass material for the glass layer contains at least two species of alkali metal elements selected from Li, Na and K, and the total amount of the alkali metal elements is greater than or equal to 20 atomic percent of the total amount of elements except oxygen contained in the glass material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.