Support assembly for an integrated circuit package having solder columns
US6791184B2 · kind B2 · utility
7Cited by
13References
40Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2002 |
| Grant date | Sep 14, 2004 |
| Priority date | — |
| Expiry date | Aug 7, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A support assembly for supporting an integrated circuit package with an array of solder columns extending from a bottom surface of the integrated circuit package to a circuit board preferably includes: a pair of shims for supporting the integrated circuit package, the shims being positioned along opposite edges of the integrated circuit package and placed between and abutting the integrated circuit package and the circuit board; and a retention clip for aligning and securing in place the pair of shims.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.