Radio frequency module and method for manufacturing the same
US6791438B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2002 |
| Grant date | Sep 14, 2004 |
| Priority date | — |
| Expiry date | Dec 31, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16153
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A rectangular penetration hole is formed opening in the opposite two main surfaces of a first dielectric substrate. Conductors for grounding are respectively formed on the main surfaces, to cover the openings of the penetration hole. A conductor layer is formed on opposite inner walls in the penetration hole of the dielectric substrate. A waveguide is structured by a space surrounded by the conductors and the conductor layers. The waveguide is magnetically coupled with an input/output line on a second dielectric substrate through a coupling slot. Because a waveguide has walls made continuous in the dielectric substrate, a low-loss waveguide can be realized. Hence, a high-performance radio frequency module can be realized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.