Connection structure for high-frequency circuit substrate, manufacturing method thereof and high frequency circuit device
US6791439B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2003 |
| Grant date | Sep 14, 2004 |
| Priority date | — |
| Expiry date | Apr 8, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10424
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A connection structure is provided, which can perform an electrical connection between high-frequency circuit substrates in a manner of high workability and productivity. A connection structure comprises: a high-frequency transmission line lead frame connecting a first high-frequency transmission line formed on a first high-frequency circuit substrate to a second high-frequency transmission line formed on a second high-frequency circuit substrate; a plurality of GND electrode lead frames disposed in parallel to the high-frequency transmission line lead frame on both sides thereof, and providing a connection between a first GND electrode of the first high-frequency circuit substrate and a second GND electrode of the second high-frequency circuit substrate; and a reinforcing substrate integrally securing the high-frequency transmission line lead frame and a plurality of GND electrode lead frames.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.