Printhead pressure relief mechanism
US6791591B2 · kind B2 · utility
5Cited by
6References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2002 |
| Grant date | Sep 14, 2004 |
| Priority date | — |
| Expiry date | Apr 11, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J25/308
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A printhead pressure relief mechanism using a non-mechanical media thickness monitoring apparatus. An increase in media thickness is monitored by an emitter/detector pair, a piezo-electric pressure sensor mounted on the print head, a metal detector or a RFID read/write assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.