Fully automatic process for magnetic circuit assembly
US6792667B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2001 |
| Grant date | Sep 21, 2004 |
| Priority date | — |
| Expiry date | Sep 18, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In accordance with the invention, a high quality magnetic device is produced without manual intervention by the step of providing a substrate including an aperture and conductive coil extending peripherally around the aperture and bonding together two parts of a magnetic body extending through the aperture. The two parts have substantially planar mating surfaces, and the bonding is effected by securing one of the parts to the substrate, applying adhesive to the portion of its mating surface exposed within the aperture, and pressing the mating surface of the second part into contact with the mating surface of the first part. During pressing, the mating surfaces are rotated in a reciprocating fashion to spread the adhesive into a thin, highly uniform film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.