Apparatus for mounting electronic components
US6792674B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2001 |
| Grant date | Sep 21, 2004 |
| Priority date | — |
| Expiry date | Dec 26, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A recognition camera images an electronic component, and a recognition processing unit performs recognition processing of the electronic component based on the result of the imaging. The recognition processing is performed using the component data of group 1 data, group 2 data, group 3 data, and group 4 data that are stored for the images taken in a random access memory (RAM). The group 1 data is used for lead inspection (for inspecting positioning error and bending of the lead), the group 2 data and the group 3 data are used for calculating amounts of adjustment in the X and Y directions, and the group 4 data is used for calculating the amount of adjustment in the &thgr; direction. This makes it possible to mount accurately components with pins and extrusions extruded from the molding, such as connectors, such that the pins and extrusions are accurately engaged with the holes formed in a print board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.