Folded fin heat sink assembly
US6793011B2 · kind B2 · utility
3Cited by
9References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2002 |
| Grant date | Sep 21, 2004 |
| Priority date | — |
| Expiry date | Feb 14, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/5313
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A folded fin heat sink assembly and a method of fabricating a folded fin heat sink assembly for use as a cooling solution in micro-electronics and/or telecommunication applications. The heat sink assembly is formed by placing a sheet or paste of Sn—Zn solder upon a copper base plate, placing one or more aluminum folded fin assemblies on the solder sheet or paste, heating the base plate, the folded fin assembly and the solder to a temperature exceeding the liquidus temperature of the solder and allowing the solder to flow, and cooling the solder to form a soldered joint between the base plate and the folded fin assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.