Solder shaping process and apparatus
US6793125B2 · kind B2 · utility
1Cited by
10References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2002 |
| Grant date | Sep 21, 2004 |
| Priority date | — |
| Expiry date | Jul 15, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K1/0056
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A process and apparatus for forming fusible solder material mounted on a substrate with the use of a tool having a treatment surface with selected shape. The solder material is heated sufficiently to cause fusing after which the tool is moved such that the treatment surface enters the fused material. The material is allowed to cool to permit re-solidification, after which the treatment surface is withdrawn from the solder, leaving the imprinted shape. The treatment surface is made of material that is not wettable by the solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.