Delamination process
US6793709B2 · kind B2 · utility
0Cited by
22References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2002 |
| Grant date | Sep 21, 2004 |
| Priority date | — |
| Expiry date | Apr 29, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02W30/62
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A process for recycling an electronic scrap material comprising a metal provided on a polymeric substrate, which method comprises: milling flaked electronic scrap material with a bead impact material in the presence of water to produce flakes of cleaned polymeric substrate; adding water to the milled material and separating the flakes of cleaned polymeric substrate from metal-containing material; dewatering and drying the flakes of cleaned polymeric substrate; and treating the metal-containing material to recover the metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.