Method for creating adhesion during fabrication of electronic devices
US6793759B2 · kind B2 · utility
12Cited by
24References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2001 |
| Grant date | Sep 21, 2004 |
| Priority date | — |
| Expiry date | Aug 4, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/381
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for creating adhesion includes plasma treating two substrates and thereafter contacting the substrates. The method can be used on a variety of dry surfaces. The method is used to adhere nonadhesive surfaces such as a cured silicone with a ceramic or semiconductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.