Stamper forming method
US6793780B2 · kind B2 · utility
0Cited by
2References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2002 |
| Grant date | Sep 21, 2004 |
| Priority date | — |
| Expiry date | Nov 15, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/095
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A stamper forming method, including the following steps: coating a first photoresist on a substrate, coating a stop layer on the first photoresist, coating a second photoresist on the stop layer, exposing the second photoresist by using a beam of light, exposing the first photoresist by using another beam of light, developing the first photoresist and the second photoresist, and sputtering a metal layer over the second photoresist. The invention also discloses another stamper forming method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.