Bonding for a micro-electro-mechanical system (MEMS) and MEMS based devices
US6793829B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2002 |
| Grant date | Sep 21, 2004 |
| Priority date | — |
| Expiry date | Aug 15, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48247
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method of bonding and packaging components of Micro-Electro-Mechanical Systems (MEMS) and MEMS based devices using a Solid-Liquid InterDiffusion (SLID) process is provided. A micro-machine is bonded to a micro-machine chip using bonding materials. A layer of chromium is first deposited onto surfaces of the micro-machine and the micro-machine chip followed by a layer of gold. Subsequently, a layer of indium is deposited between the layers of gold, and the surface of the micro-machine is pressed against the surface of the micro-machine chip forming a gold-indium alloy to serve as a bond between the micro-machine and the micro-machine chip. In addition, a cover is bonded to the micro-machine chip in the same manner providing a hermetic seal for the MEMS based device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.