Patent · US Expired

Wafer thinning using magnetic mirror plasma

US6794272B2 · kind B2 · utility

63Cited by

8References

19Claims

0Family size

Assignee

iFire Technologies, Inc. · US

Inventors

Terry R. Turner · Austin, US
James D. Spain · Georgetown, US
Richard Banks · Egham, GB

Key dates

Filing date	Mar 18, 2003
Grant date	Sep 21, 2004
Priority date	—
Expiry date	Mar 18, 2023

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S438/977
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for manufacturing integrated circuits uses an atmospheric magnetic mirror plasma etching apparatus to thin a semiconductor wafer. In addition the process may, while thinning, both segregate and expose through-die vias for an integrated circuit chip. To segregate, the wafer may be partially diced. Then, the wafer may be tape laminated. Next, the backside of the wafer may be etched. As the backside material is removed, the partial dicing and through-die vias may be exposed. As such, the method reduced handling steps and increases yield. Furthermore, the method may be used in association with wafer level processing and flip chip with bump manufacturing.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.