Method for producing organic thin-film device by use of facing-targets-type sputtering apparatus
US6794278B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 9, 2002 |
| Grant date | Sep 21, 2004 |
| Priority date | — |
| Expiry date | May 8, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K85/631
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed is a method for forming a thin-film layer, such as a metallic film or a transparent conductive film, on a functional organic layer formed from an organic compound, by means of a sputtering method performed at a low discharge voltage and a low gas pressure, without imparting any damage to the surface of the organic layer. The thin-film layer is formed by use of a facing-targets-type sputtering apparatus including a pair of facing targets disposed a predetermined distance away from each other; an electron reflection electrode disposed on the periphery of each target; and magnetic field generation means disposed at the sides of each target. The magnetic field generation means generates a magnetic field extending from one target to the other so as to surround a confinement space provided between the paired targets, as well as a magnetic field having a portion parallel to the surface of each target in the vicinity of a peripheral edge portion of the target. When an AC-DC power containing a DC component and a high-frequency component is supplied as a sputtering power to the apparatus, the thin-film layer can be formed at a lower discharge voltage and a lower gas pressure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.