Hot melt adhesive composition
US6794443B2 · kind B2 · utility
7Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2003 |
| Grant date | Sep 21, 2004 |
| Priority date | — |
| Expiry date | Mar 2, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A low application temperature, high heat resistant hot melt adhesive comprising an ethylene vinyl acetate and/or ethylene 2-ethyl hexyl acrylate polymer having a melt index of at least 550 grams/10 minutes, a paraffin wax and a rosin derived tackifier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.