Patent · US Expired

Single receiving side contactless electronic module continuous manufacturing process

US6794727B2 · kind B2 · utility

16Cited by
2References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 25, 2002
Grant dateSep 21, 2004
Priority date
Expiry dateDec 19, 2022

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49174
  • WIPO fieldComputer technology
  • WIPO sectorElectrical engineering

Abstract

A process for continuous manufacture of electronic modules (6) including the steps of providing a microcircuit and antenna receiving side on a continuous strip (8) and module surface areas; arranging, e.g., by printing, on the module surface area, a plane spiral antenna (2) wholly arranged to this area; fixing on said strip (8) a microcircuit (7) provided with contact pads (13, 14) after placing an insulator between the microcircuit the strip (8); making an electric connection between the antenna (2) and of the microcircuit.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.