Cooling system
US6795315B1 · kind B1 · utility
34Cited by
8References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2003 |
| Grant date | Sep 21, 2004 |
| Priority date | — |
| Expiry date | Jul 30, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling system for cooling an interface card is provided. The cooling system comprises a thermal conductive housing wrapping around a carrier of the interface card and the electronic devices thereon. A pair of fans are set up on the housing to provide a flow of air inside the space between the housing and the carrier so that the heat generated by the operating devices are rapidly carried away. In addition, a fin type heat sink can be incorporated into the space between the housing and the electronic devices to increase the amount of heat transferred away from the operating devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.