Method of forming a slider/suspension assembly
US6796018B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 21, 2001 |
| Grant date | Sep 28, 2004 |
| Priority date | — |
| Expiry date | Nov 25, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49798
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A slider/suspension design and assembly method include securing a slider to a suspension assembly for use in a magnetic disk drive data recording device. To this end, a solder fillet bond is applied at the leading edge surface of the slider to provide a structural connection of the slider to the flexure, while also enabling the slider-suspension assembly to be separated without damage during the process. The slider/suspension assembly is initiated by forming a plurality of sliders on a wafer, in such a manner that the trailing edge surfaces of the sliders form the front side of the wafer, and the leading edge surfaces of the sliders form the backside of the wafer. A plurality of thin film data transducing elements and a plurality of electrical contact pads are then formed on the wafer front side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.