Process for making a heater chip module
US6796019B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2002 |
| Grant date | Sep 28, 2004 |
| Priority date | — |
| Expiry date | Jun 10, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A process is provided for forming a heater chip module comprising a carrier adapted to be secured to an ink-filled container, at least one heater chip having a base coupled to the carrier, and at least one nozzle plate coupled to the heater chip. The carrier includes a support substrate having at least one passage which defines a path for ink to travel from the container to the heater chip. The heater chip is secured at its base to a portion of the support substrate. At least the portion of the support substrate is formed from a material having substantially the same coefficient of thermal expansion as the heater chip base. A flexible circuit is coupled to the heater chip module such as by TAB bonding or wire bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.