Method of manufacturing printed wiring board
US6796027B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 2002 |
| Grant date | Sep 28, 2004 |
| Priority date | — |
| Expiry date | Sep 2, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of efficiently manufacturing a printed wiring board is provided. In this method, a metal thin film is formed on a substrate having a projection. Then, an initial circuit pattern is formed on the substrate by patterning the metal thin film. The initial circuit pattern comprises first and second circuit patterns isolated from each other and a conductive layer formed on the projection to make a temporary electrical connection between the first and second circuit patterns. Electroplating is performed by the passage of electric current through the initial circuit pattern to form an additional metal film on the initial circuit pattern. After the electroplating, the conductive layer on the projection is removed to provide electrical insulation between the first and second circuit patterns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.