Patent · US Expired

All polymer humidity sensor based on laser carbonized polyimide substrate

US6796166B1 · kind B1 · utility

3Cited by
9References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 2, 2002
Grant dateSep 28, 2004
Priority date
Expiry dateJan 24, 2023

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01N27/126
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A sensing device formed upon a substrate, including a method of forming the sensing device. A substrate can be provided, which is formed from a polymer. A sensor circuit can then be patterned and formed upon the substrate. One or more carbonized filaments can also be formed upon the substrate for use with the sensor circuit. The sensor circuit itself can comprise a capacitive type sensor circuit. A polymer can be coated over the sensor circuit and circuit components thereof to form an all polymer sensor for use in detecting chemical agents. Such a hygrosensitive polymer can comprise, for example, HMPTAC (2-hydroxy-3-methacryloxypropyl trimethylammonium chloride). The all polymer sensor formed thereof can also be utilized as a humidity sensor. The polymer can be laser carbonized by an argon ion laser to form the plurality of carbonized filaments.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.