Chip mounting method
US6796481B2 · kind B2 · utility
13Cited by
8References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 12, 2002 |
| Grant date | Sep 28, 2004 |
| Priority date | — |
| Expiry date | Jul 12, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for mounting a chip on a substrate includes applying the underfill agent onto at least one of the substrate and the chip and moving the chip to the substrate to bring the bump into contact with the electrode. The method also includes steps to distribute the underfill agent in a space between the chip and the substrate, to around the bump and the electrode, heating the bump or electrode in the state that the bump is buried in the underfill agent to melt the bump or electrode so as to weld the bump to the electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.