Use of printing and other technology for micro-component placement
US6796867B2 · kind B2 · utility
53Cited by
154References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2002 |
| Grant date | Sep 28, 2004 |
| Priority date | — |
| Expiry date | Oct 26, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2217/49285
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An improved light-emitting panel having a plurality of micro-components sandwiched between two substrates is disclosed. Each micro-component contains a gas or gas-mixture capable of ionization when a sufficiently large voltage is supplied across the micro-component via at least two electrodes. An improved method of manufacturing a light-emitting panel is also disclosed, which uses a web fabrication process to manufacturing light-emitting displays as part of a high-speed, continuous inline process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.