Composite substrate and EL device using the same
US6797413B2 · kind B2 · utility
11Cited by
6References
47Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2001 |
| Grant date | Sep 28, 2004 |
| Priority date | — |
| Expiry date | Apr 4, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S428/917
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention aims to provide a composite substrate which suppresses reaction of a substrate with a dielectric layer that can otherwise cause degradation of the dielectric layer and which can be sintered at high temperature while minimizing the occurrence of cracks in the dielectric layer, and an EL device using the composite substrate. The object is attained by a composite substrate in which an electrode and a dielectric layer are successively formed on an electrically insulating substrate, the substrate having a coefficient of thermal expansion of 10-20 ppm/K, and an EL device using the composite substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.