Method and apparatus for thermal processing a photosensitive element
US6797454B1 · kind B1 · utility
50Cited by
5References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2002 |
| Grant date | Sep 28, 2004 |
| Priority date | — |
| Expiry date | Jun 6, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/36
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method and apparatus for thermal processing a photosensitive element includes heating a composition layer on a flexible substrate to a melt temperature of an unirradiated area of the composition layer and maintaining the flexible substrate at a temperature below the melt temperature while pressing a heated absorbent layer against the heated composition layer, and repeating these steps for multiple cycles. A further embodiment of the method includes a step of cooling the flexible substrate and layer laminate on each cycle to maintain the flexible substrate at the desired temperature below that of the heated composition layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.