Flame-retardant epoxy resin composition, molded article thereof, and electronic part
US6797750B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2002 |
| Grant date | Sep 28, 2004 |
| Priority date | — |
| Expiry date | Nov 7, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0373
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention has an object to provide a flame-retardant epoxy resin composition excellent in heat resistance and moisture resistance. A flame-retardant epoxy resin composition relating to the present invention contains an epoxy resin (A), a phosphazene compound (B), an epoxy hardener (C) and an inorganic filler (D), wherein the phosphazene compound (B) and the epoxy hardener (C) are included in the range of 0.01 to 70% by weight and in the range of 0 to 70% by weight, respectively, relative to a total quantity of the epoxy resin (A), the phosphazene compound (B) and the epoxy hardener (C), and the inorganic filler (D) is included in the range of 0 to 95% by weight relative to a total quantity of the epoxy resin (A), the phosphazene compound (B), the epoxy hardener (C) and the inorganic filler (D), wherein the phosphazene compound (B) is at least one selected from the group consisting of (1) a cyclic and/or a chain phosphazene compound with a specific structure, (2) a polymer of the cyclic and/or the chain phosphazene compound; and (3) a reaction product of the cyclic and/or the chain phosphazene compound with one type of a compound selected from the group consisting of an …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.