Multiple semiconductor chip (multi-chip) module for use in power applications
US6798061B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 15, 1999 |
| Grant date | Sep 28, 2004 |
| Priority date | — |
| Expiry date | Nov 15, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multiple semiconductor chip (multi-chip) module for use in power applications includes at least a power semiconductor chip and a control semiconductor chip mounted on an electrically conductive heat sink. The power semiconductor chip may be a Silicon-On-Insulator (SOI) device and the control semiconductor chip may be a semiconductor device having a substrate connected to ground potential. The power semiconductor chip and the control semiconductor chip are directly mounted on the electrically conductive heat sink without the use of a separate electrical insulation layer in order to obtain a multi-chip module which is simple and economical to manufacture, and which offers superior performance characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.