Chassis conducted cooling thermal dissipation apparatus for servers
US6798661B1 · kind B1 · utility
12Cited by
7References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 8, 2003 |
| Grant date | Sep 28, 2004 |
| Priority date | — |
| Expiry date | May 8, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal dissipation apparatus for implementing chassis conducted cooling for a server. The apparatus includes a heat sink having a first surface and a second surface. The first surface is adapted to accept a chip thermal interface for a chip. The second surface is adapted to accept a chassis thermal interface for a chassis surface, wherein the second surface implements a thermal conductive path from the chip to the chassis surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.