Guides lithographically fabricated on semiconductor devices
US6798953B1 · kind B1 · utility
7Cited by
3References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 7, 2000 |
| Grant date | Sep 28, 2004 |
| Priority date | — |
| Expiry date | Jan 7, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/3652
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A structure that includes a substrate, typically a semiconductor chip such as a VCSEL or photodetector chip, and a guide for aligning a signal conveying device, typically an optical fiber, to a transducer such as an optoelectronic device on the semiconductor chip. The guide is formed, in a preferred embodiment, by lithographically exposing and developing a thick layer of photoresist. The structure is assembled by placing and securing the signal conveying device into a cavity-like region of the guide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.