Packaged optical micro-mechanical device
US6798954B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2001 |
| Grant date | Sep 28, 2004 |
| Priority date | — |
| Expiry date | Aug 26, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4231
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A packaged optical micro-mechanical device. A die includes one or more optical micro-mechanical devices on a first surface of a substrate. The first surface includes a die reference surface. A package frame includes an aperture and a package frame reference surface proximate the aperture adapted to receive the die reference surface such that the optical micro-mechanical devices are located in the aperture. One or more V-grooves are positioned relative to an optical interface reference plane adjacent to the micro-mechanical devices and terminating adjacent to the aperture. One or more optical fibers are located in the V-grooves optically coupled with one or more of the optical micro-mechanical devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.