Method for the metallization of optical fibers
US6798963B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 3, 2002 |
| Grant date | Sep 28, 2004 |
| Priority date | — |
| Expiry date | May 3, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/02395
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An improved method for providing high-quality optical fiber metallization with the required length at the required location. The method enables metallized optical fibers to be soldered and connected to mechanical components while reducing the level of stress in the metal coatings and providing strong adhesion, good conductivity and connectivity. The advantage of the method is a combination of vacuum evaporation and electroless deposition for the optical fiber metallization. A strong adhesion of the metal layer is achieved by the use of an evaporated thin metal layer, comprising an adhesion layer and a seed layer. The stress reduction is achieved due to electroless deposition, which is adequately thick for subsequent soldering/welding or other applications. The method comprises preparation for evaporation, preparation of optical fibers, evaporation of the thin metal adhesion and seed layer on the optical fiber, electroless deposition of an adequately thick metal layer, and acceptance testing. Metallization of optical fibers at any location across the fiber (patterned metallization) additionally includes application of an organic masking layer to the fiber before the metallization pr…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.