Method of estimation of wafer polish rates
US6799136B2 · kind B2 · utility
8Cited by
9References
10Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 8, 2002 |
| Grant date | Sep 28, 2004 |
| Priority date | — |
| Expiry date | Jan 7, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for extracting blanket (qual) polish rates from interferometry signals off patterned (product) wafer polish during non-enpointed CMP. The method includes estimating polish rates using polish data near the end of the polish period. Non-linear regression and iterative optimization is presented to extract relevant information. The processing includes least square processing step (43), determining the search fit (44) and determining if this is the best fit (45).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.