Patent · US Expired

High power LED power pack for spot module illumination

US6799864B2 · kind B2 · utility

185Cited by
18References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 24, 2002
Grant dateOct 5, 2004
Priority date
Expiry dateMay 24, 2022

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S362/80
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A light module includes a light emitting diode assembly defining a front side light emitting diode array and a rear side. The rear side is in thermal communication with a thermally conductive spreader, and a thermally conductive core is in thermal communication with the conductive spreader. The thermally conductive core includes an electrical conductor in operative communication with the front side light emitting diode array, and a plurality of appendages disposed about the thermally conductive core such that they are in thermal communication with the conductive spreader.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.