Optoelectronic mounting structure

US6799902B2 · kind B2 · utility

Assignee

• EMCORE CORPORATION · US

Inventors

• Gene R. Anderson · Albuquerque, US
• Marcelino G. Armendariz · Albuquerque, US
• Johnny R.F. Baca · Albuquerque, US
• Robert P. Bryan · Albuquerque, US
• Richard F. Carson · Albuquerque, US
• Dahwey Chu · Albuquerque, US
• Edwin B. Duckett, III · Albuquerque, US
• Frederick B. McCormick, Jr. · Lisle, US
• David W. Peterson · Clinton, US
• Gary Peterson · Albuquerque, US
• Cathleen A. Reber · Corrales, US
• Bill H. Reysen · Lafayette, US

Key dates

• Filing date: Dec 26, 2000
• Grant date: Oct 5, 2004
• Expiry date: Jan 27, 2022

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3025
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

An optoelectronic mounting structure is provided that may be used in conjunction with an optical transmitter, receiver or transceiver module. The mounting structure may be a flexible printed circuit board. Thermal vias or heat pipes in the head region may transmit heat from the mounting structure to the heat spreader. The heat spreader may provide mechanical rigidity or stiffness to the heat region. In another embodiment, an electrical contact and ground plane may pass along a surface of the head region so as to provide an electrical contact path to the optoelectronic devices and limit electromagnetic interference. In yet another embodiment, a window may be formed in the head region of the mounting structure so as to provide access to the heat spreader. Optoelectronic devices may be adapted to the heat spreader in such a manner that the devices are accessible through the window in the mounting structure.