Two-layer connector assembly
US6799995B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 4, 2003 |
| Grant date | Oct 5, 2004 |
| Priority date | — |
| Expiry date | Sep 4, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R24/64
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Double-layer connector assembly has an upper-layer shielding housing, a lower-layer shielding housing, and a number of two-layer modules. Each two-layer module has an upper unit, a lower unit, and a supporting body. The upper unit has upper output pins and an upper guiding plate, and the lower unit has lower output pins and a lower guiding plate. The upper guiding plate and the lower guiding plate are connected by the supporting body and form a slit. Supporting plates of the upper-layer shielding housing and the lower-layer shielding housing are installed into the slit so that the upper-layer shielding housing, the lower-layer shielding housing are installed, and two-layer modules are connected together. Besides, processing circuits are selectively connected to the output pins of the upper and lower units so that the design is more compact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.