Cutting device for separating individual laminated chip assemblies from a strip thereof, method of separation and a method of making the cutting device
US6800018B2 · kind B2 · utility
5Cited by
8References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 12, 2002 |
| Grant date | Oct 5, 2004 |
| Priority date | — |
| Expiry date | Feb 12, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10253
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An abrasive wheel is used to separate individual laminated chips from a strip by cutting through the copper bridging elements. The abrasive wheel is made up of abrasive particles bonded in a matrix having a high glass transition temperature and a cutting edge having a maximum thickness of the order of 350 micron, whereby the cut is substantially straight and free of smears and burrs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.