Electroless nickel plating solutions
US6800121B2 · kind B2 · utility
38Cited by
9References
26Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 18, 2002 |
| Grant date | Oct 5, 2004 |
| Priority date | — |
| Expiry date | Nov 4, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/36
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This invention relates to aqueous electroless nickel plating solutions, and more particularly, to nickel plating solutions based on nickel salts of alkyl sulfonic acids as the source of nickel ions. The plating solutions utilize, as a reducing agent, hypophosphorous acid or bath soluble salts thereof selected from sodium hypophosphite, potassium hypophosphite and ammonium hypophosphite. The electroless nickel plating solutions of the invention are free of added nickel hypophosphite, and free of alkali or alkaline earth metal ions capable of forming an insoluble orthophosphite.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.